PCB Design & Layout
Multi-layer board design, impedance control, signal and power integrity, EMI/EMC-driven placement. Production-ready output including Gerber, BOM and Pick&Place.
Available for new projects
Concept, schematic, multi-layer PCB, prototype and test — I run the entire hardware development chain myself. From STM32-based control boards to power electronics, sensor fusion and high-speed digital design.
Expertise
I take the chain from schematic to manufacturing files end to end, so the design decisions that usually get lost between separate vendors stay with one responsible engineer.
Multi-layer board design, impedance control, signal and power integrity, EMI/EMC-driven placement. Production-ready output including Gerber, BOM and Pick&Place.
STM32 and ARM Cortex-M based control boards, sensor integration, CAN / RS-485 / Modbus communication layers and hardware-software integration.
SMPS topologies (Flyback, Buck-Boost, LLC), motor driver stages, high-current routing, thermal balancing and hardware-level protection circuits.
Technical feasibility, concept development, test protocols and documentation. Experience writing and running projects under TÜBİTAK 1512 and KOSGEB R&D programmes.
Selected work
The modules below are prototypes designed, manufactured and tested as part of R&D work.
Multi-layer processing board based on the Broadcom BCM2712 SoC and DDR4 memory, designed for high-bandwidth applications. Impedance and length matching on the DDR topology, a layered power-distribution network and signal-integrity verification were the design priorities.
PWM-based driver board for Hall-sensored brushless motors. Short gate-driver routing, wide multi-via copper pours on high-current paths and hardware-level protection layers.
Control and driver boards developed for laboratory instruments: analog front-end conditioning of low-level optical sensor signals, high-resolution ADC acquisition, motor and pump drive. Analog and digital sections were separated across a multi-layer stack-up for measurement stability and EMI immunity; isolation distances were planned with IEC 60601-1 in mind.
How I work
Clarifying requirements, constraints and target cost
Scope, schedule and cost agreed in writing
Schematic, component selection and multi-layer layout
Manufacturing files, sourcing and first article assembly
Measurement, failure analysis and design verification
Corrections from findings and a production-ready release
Let's talk through the scope and technical constraints — I'll come back with a clear picture of the steps and the time it takes.