Available for new projects

Electronic hardware design and R&D engineering

Concept, schematic, multi-layer PCB, prototype and test — I run the entire hardware development chain myself. From STM32-based control boards to power electronics, sensor fusion and high-speed digital design.

LocationAnkara, Türkiye · available remotely
Experience7+ years in hardware and R&D
FocusPCB design · embedded control · power electronics
PlatformSTM32 · ARM Cortex‑M · Raspberry Pi
ToolsAltium Designer · KiCad
Standardsreferencing IPC‑2152 · IPC‑2581
7+
years of engineering experience
3
completed R&D projects
2–6
layer PCB stack-ups
8
hardware modules designed

Expertise

The whole hardware chain, one owner

I take the chain from schematic to manufacturing files end to end, so the design decisions that usually get lost between separate vendors stay with one responsible engineer.

PCB Design & Layout

Multi-layer board design, impedance control, signal and power integrity, EMI/EMC-driven placement. Production-ready output including Gerber, BOM and Pick&Place.

Embedded Control Systems

STM32 and ARM Cortex-M based control boards, sensor integration, CAN / RS-485 / Modbus communication layers and hardware-software integration.

Power Electronics

SMPS topologies (Flyback, Buck-Boost, LLC), motor driver stages, high-current routing, thermal balancing and hardware-level protection circuits.

R&D & Project Consulting

Technical feasibility, concept development, test protocols and documentation. Experience writing and running projects under TÜBİTAK 1512 and KOSGEB R&D programmes.

Selected work

Hardware modules

The modules below are prototypes designed, manufactured and tested as part of R&D work.

High-Speed Processing Board — BCM2712 + DDR4

2023–2024 Prototype High-Speed PCB

Multi-layer processing board based on the Broadcom BCM2712 SoC and DDR4 memory, designed for high-bandwidth applications. Impedance and length matching on the DDR topology, a layered power-distribution network and signal-integrity verification were the design priorities.

Katman / Layers6
Boyut / Size100 × 120 mm
İşlemci / SoCBroadcom BCM2712
Bellek / MemoryDDR4
Standart / StandardJEDEC JESD79-4
Signal IntegrityLength MatchingPDNDDR4

Sensored Brushless Motor Controller (ESC)

2021–2023 Prototype Power Electronics

PWM-based driver board for Hall-sensored brushless motors. Short gate-driver routing, wide multi-via copper pours on high-current paths and hardware-level protection layers.

Gerilim / Voltage30–60 V
Kontrol / ControlPWM · tork ve hız
Geri besleme / FeedbackHall sensör
Koruma / ProtectionAkım · sıcaklık
BLDCGate DriverPWMCurrent Sensing

Medical Device Control and Driver Boards

2018–2022 Prototype Embedded Systems

Control and driver boards developed for laboratory instruments: analog front-end conditioning of low-level optical sensor signals, high-resolution ADC acquisition, motor and pump drive. Analog and digital sections were separated across a multi-layer stack-up for measurement stability and EMI immunity; isolation distances were planned with IEC 60601-1 in mind.

Ölçüm / AcquisitionAnalog front-end + yüksek çözünürlüklü ADC
Arayüz / InterfaceSPI · I²C · UART · RS-485
Referans / ReferenceIEC 60601-1 izolasyon mesafeleri
Analog Front-EndHigh-Res ADCMulti-Layer PCBLow Noise

How I work

From analysis to manufacturing files

01

Analysis

Clarifying requirements, constraints and target cost

02

Proposal

Scope, schedule and cost agreed in writing

03

Design

Schematic, component selection and multi-layer layout

04

Prototype

Manufacturing files, sourcing and first article assembly

05

Test

Measurement, failure analysis and design verification

06

Revision

Corrections from findings and a production-ready release

Have a hardware idea?

Let's talk through the scope and technical constraints — I'll come back with a clear picture of the steps and the time it takes.